
| BETAsoft Newsletters |
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Over the past few years, the BETAsoft Thermal Analysis Newsletter has touched bases on quite a few topics. We would like you to have the opportunity to review these newsletters and we would like to solicit your opinion by suggesting new topics of interest for the coming years. Click on the topic below to either view the newsletter or request the newsletter to be emialed to you. NEW HIGHLIGHTS: Why BETAsoft is Still the Best Choice, 1/2006 Read this newsletter for a detailed comparison between BETAsoft and other PCB thermal analysis software on the market today. New Interface from BETAsoft to Thermal Desktop, 3/2006 Read this newsletter to get more details on the new interface to Thermal Desktop and how it can help you. The BETAsoft 10 Minute Movie, 10/2005 This newsletter describes the BETAsoft movie that walks you through many of the features and menus of BETAsoft Board. Automotive Board Thermal Analysis, 5/2005 This newsletter describes the special version of BETAsoft that was developed for the Auto industry that will model the high power generating traces that are frequently found on automotive boards. NEW!! BETAsoft Demo Runs Analysis, 7/2004 BETAsoft-Board now has a new demo that will run the analysis on a board with 10 components on the front side of the board. This newsletter describes the demo and how it can help you. New Release of BETAsoft-Board Version 8.2, 12/2004 This issue of the newsletter describes the new features that were added to the version 8.2 release. BETAsoft CAPABILITIES: How To Choose a Thermal Software, 7/2002 Choosing a thermal analysis software can cometimes be a very confusing task. This issue addresses the different types of thermal analysis software as well as how to choose the best one for your work. Cherish the Speed and Friendliness of Thermal Analysis, 9/2003 This issue describes how the lightning speed of BETAsoft Thermal Analysis Software can save you time in your work. With more than 400 components on a 800 MHz PC, the analysis takes only 20 seconds to run, yet the accuracy is still the best inn the market today. BETAsoft Libraries, 2/2004 BETAsoft-Board has four important libraries incorporated into the software. This issue describes how to use these libraries to their full potential. BETAsoft Maintenance and Support, 4/2004 This issues describes the need and use that our users may have for a maintenance contract. The contract covers technical support needed by anyone at the registered company as well as updates to the software package and ECAD interface. Iterative Exploration of Thermal Designs, 12/2002 Iterative thermal analysis gives the comparison among the effectiveness of different solutions, and finds theoptimal use of each solution. This issue describes the iterative exploration in detail. How BETAsoft Can Help Your Design Team, 9/2004 BETAsoft-Board can benefit Electronic Engineers and Mechanical Engineers alike. View this newsletter to learn how. Thermal-Reliability Analysis, 8/2002 This issue describes how to use BETAsoft to calculate the junction temperature of each component on the board and then import those temperatures into Relex Reliability software to calculate the Mean Time Between Failure (MTBF). Combined Board/Component Thermal Design, 6/2003 Many applications can benefit from the conjunction of BETAsoft-Board and BETAsoft-MCM/IC. This issue describes how the two can work together to give optimum thermal results. New Release of Version 8.1, 7/2003 This issue of the newsletter describes the new features that were added to the version 8.1 release including a material library, power, CAD imports, and more. BETAsoft Benefit Analysis, 6/2005 This issue describes the benefits that your company will encounter if they begin using BETAsoft. APPLICATION NOTES: Thermal Issues on High Speed Boards, 5/2002 Now, more and more boards come into the high-speed arena, where E-M noise becomes a primary concern. Due to the high clock speed, the power consumption rate is alos increased dramatically. This issue addresses cooling techniques of these boards. Thermal Analysis Software Predicts Performance of Satellite Component, 2/2003 This issue is the article that appeared in the December 2002 issue of NASA Tech Briefs (Application Briefs, P. 64) that spotlights a case study where BETAsoft was used to help build the PCB located inside a satellite. Aerospace and Military Applications, 3/2005 This newsletter shows a look at how BETAsoft can be helpful in Military and Aerospace industries. Thermal Analysis of Military Electronics, 4/2003 In Military electronics, including space, avionics, and ground-based applications, severe environment is usually encountered where wide ranges of temperature, air quality, and solar radiation may all be factors. This issue describes how the two can work together to give optimum thermal results. |
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Dynamic Soft
Analysis, Inc.
P. O. Box 8119 Pittsburgh PA 15217 Tel: 412.422.3270 email: BETAsoft_info@mentor.com Copyright© 2003, Dynamic Soft Analysis, Inc. All rights reserved |