The BETAsoft-Board software was specially designed for board level thermal analysis. It outputs board temperature and gradient maps, component and junction temperatures, and the amount those temperatures exceed their respective limits The software has the capability of modeling electronic boards with up to 3000 components on each side considering conduction, convection and radiation.

BETAsoft-Board interfaces with numerous ECAD placement programs to allow quick and easy transfer of component placement and parameter information. The junction temperatures calculated by the analysis can be transferred into reliability software to improve the reliability predictions.

BETAsoft-Board is used routinely in various industrial applications, including Aerospace, Computer, Networking, Telecom, Industrial Control, Instrumentation and Automotive electronics. The program has been tested and validated extensively in-house, and by our hundreds of users in the past 10 years. Continuous updating and new releases ensure that our users requests are addressed and satisfied.

The BETAsoft programs have been well recognized as the leaders in thermal analysis software and is still the best on the market . BETAsoft-Board reveals the board temperatures and gradients, component and junction temperatures, and the amount they exceed their respective limits. The software supports space, avionic, defense, telecom, computer, automotive, medical, instrumentation, and power supply industries. BETAsoft-Board has been the most popular thermal analysis software world-wide due to the following outstanding features:

Accurate and Fast Analysis: An accuracy of 10% has been consistently validated by our users and experimental wind tunnel and infrared image tests. The analysis performs fully 3-Dimensional modeling of the complex flow and thermal fields based on heat conduction, convection, and radiation. Finite difference schemes with self-adaptive locally refined meshes are used in the computation to produce extremely fast, yet accurate results. The analysis needs only 1/50 of the time of equivalent finite element programs. Typically, an analysis takes 12 seconds for a board of 100 components run on a 100 MHz Pentium PC.

Easy To Use: Automatic interfaces with Expedition, PADS, Board Station, Allegro, CADSTAR, OrCAD, P-CAD, Protel, Visula, and other placement packages are available. Colorful temperature and gradient maps create output that is easy to read and impressive in reports.

Advanced Features: BETAsoft-Board can evaluate boards of multi-layers and irregular shapes. The board can be: placed at the edge or interior of a cabinet, anchored by screws to heat sinks, cooled through wedge locks at the edges, in a sealed compartment, or in an open system with forced convection. The flow field can be natural or forced convection, and closed systems can be cooled by heat exchangers. Effects of gravity, air pressures, and flow directions are modeled. Heat sinks, heat pipes, chip fans, and conduction pads can be attached to components.