BETAsoft-SiP / MCM

Fully menu driven and intuitive Supports Windows 95, 98, & NT operating systems Transient analysis with time-varying power sources Accuracy within 10% of measured data Computation time of 3 minutes on 300 MHz PC

BETAsoft-SiP(System in Package)/MCM predicts the thermal performance of MCMs, BGAs, ASICs, SiPs, SoCs, Hybrids and general components to ensure reliable thermal packaging. It considers three-dimensional complex internal structures and materials with single or multiple time-varying power sources. A transient or steady state analysis can be performed to identify severe temperature excursion or thermal stress concentration. The external cooling conditions can be interfaced from BETAsoft-Board to simulate a real working environment. BETAsoft-SiP/MCM is tailored specifically towards packaging concerns to help you create products that are more reliable.

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	Dynamic Soft Analysis, Inc. P. O. Box 8119 • Pittsburgh • PA • 15217 Tel: 412.422.3270 email: BETAsoft_info@mentor.com Copyright© 2003, Dynamic Soft Analysis, Inc. All rights reserved