BETAsoft Thermal Analysis Software products are used to analyze the thermal behavior of electronic boards and components while they are still in the design stage, eliminating timely prototype redesign.

BETAsoft Thermal Analysis Software suites include the considerations of heat conduction, air convection and thermal radiation in three dimensional configurations. The board thermal analysis software results identify the hot spots and components on the board that designers may modify by various means to eliminate thermal problems. Typical solutions are adding heat sinks, thermal pads, and thermal vias, using thicker ground or power planes, local conduction pads, thermal screws, changing of radiation emissivity by coatings, or relocate components.

For the component thermal analysis software, the results of simulation provide the transient thermal field in the MCM, BGA, or CSP etc. The designers may modify the geometry, change the material, or re-arrange the multi-chips to achieve a low thermal resistance between junctions and casing based on the thermal analysis results.

Board Level Thermal Analysis Software: BETAsoft-Board Thermal Analysis Software is available in 3 different versions, Standard, Easyboard, and Trace, to cover all industries of PCB thermal design. The standard version simulates printed circuit boards of up to 1500 components on each side in any environment. The Easyboard version has a trimmed down capacity at a low price. The trace version was developed specifically for severe heating on the board plane due to high currents passing through the heavy traces, which is common for automotive boards. Any of these thermal modeling software packages include one seamless interface to the ECAD/MCAD of your choice and 30 days of technical support (one year for the network version). Designed for the electronic engineer, BETAsoft-Board has grown to be the preferred solution in all industries worldwide for both electronic engineers and mechanical engineers.

Component Level Thermal Analysis Software: BETAsoft-MCM/IC Thermal Analysis Software is available on PC for heat transfer modeling in MCM’s, BGA’s, CSP, IC’s, hybrids, and all other types of components. The thermal environment of the component can be obtained from BETAsoft-Board that an accurate estimation can be considered. For users who use the electronic board ECAD software to design the MCMs, the design can be interface to the BETAsoft-MCM/IC too.

BETAsoft Thermal Analysis Software keeps growing with the electronic industry. Powered by the evolution of thermal management technology and suggestions from our worldwide users, BETAsoft Thermal Analysis Software is updated annuallly. In addition, our thermal experts provide hot line technical support to users for any challenge they may encounter in their thermal designs. BETAsoft has been the leader in the thermal analysis software industry for many years and helps to achieve superior thermal reliability in your electronic designs.

Please download a free demo and see for yourself how intuitive BETAsoft really is. Your comments or inquiries are very much welcome.

 

 
 

Dynamic Soft Analysis, Inc.
5001 Baum Blvd., Suite 787 • Pittsburgh • PA • 15213
Tel: 412.422.3270
Fax: 412.422.0621
email: BETAsoft_info@mentor.com
Copyright© 2003, Dynamic Soft Analysis, Inc. All rights reserved
 

 

Thermal Analysis Software
BETAsoft technology is acquired by Mentor Graphics Corp.
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BETAsoft-Board and BETAsoft SiP/MCM provides easy to use thermal analysis software with the fastest analysis on the market today. The BETAsoft products are used to analyze the thermal behavior of electronic boards and components while they are still in the design stage, eliminating timely prototype redesign. Our software is unique because it is extremely fast and user friendly while maintaining excellent accuracy in predicting temperatures. The PCB (Board) Thermal Analysis Software will analyze a board with 400 components in less than one minute which allows for fast turn over in design iterations. The user interfaces in all BETAsoft products are very intuitive so that no training is needed by users. This user-friendliness is very important to users who are EE's without thermal background or those using thermal analysis infrequently. BETAsoft interfaces with most ECAD (and now MCAD containing IDF) placement software and Reliability Software. The software is developed by Dynamic Soft Analysis, Inc. and has been a leader in the market for the past 16 years. The 32 bit programs were written specifically for all Windows platforms.